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|Acronym=IRPS 2020 | |Acronym=IRPS 2020 | ||
|Title=2020 IEEE International Reliability Physics Symposium | |Title=2020 IEEE International Reliability Physics Symposium | ||
+ | |In Event Series=Event Series:IRPS | ||
+ | |Single Day Event=no | ||
+ | |Start Date=2020/04/28 | ||
+ | |End Date=2020/05/30 | ||
+ | |Event Status=as scheduled | ||
+ | |Event Mode=online | ||
+ | |Academic Field=Physics | ||
+ | |Official Website=https://irps.org/ | ||
+ | |DOI=10.25798/yvpq-b660 | ||
|Type=Conference | |Type=Conference | ||
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|has general chair=Gaudenzio Meneghesso | |has general chair=Gaudenzio Meneghesso | ||
|has program chair=Charles Slayman | |has program chair=Charles Slayman | ||
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|pageEditor=User:Curator 52 | |pageEditor=User:Curator 52 | ||
|contributionType=1 | |contributionType=1 | ||
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}} | }} | ||
{{Event Deadline}} | {{Event Deadline}} | ||
+ | {{Organizer | ||
+ | |Contributor Type=organization | ||
+ | |Organization=IEEE Electron Devices Society, Institute of Electrical and Electronics Engineers | ||
+ | }} | ||
+ | {{Organizer | ||
+ | |Contributor Type=organization | ||
+ | |Organization=IEEE Reliability Society, Institute of Electrical and Electronics Engineers | ||
+ | }} | ||
+ | {{Event Metric}} | ||
{{S Event}} | {{S Event}} | ||
Sollte eigentlich vom 29.03.2020-02.04.2020 in Dallas, Texas, USA stattfinden, wurde aufgrund der COVID-19 Pandemie aber zeitlich verschoben und als Online-Konferenz abgehalten. | Sollte eigentlich vom 29.03.2020-02.04.2020 in Dallas, Texas, USA stattfinden, wurde aufgrund der COVID-19 Pandemie aber zeitlich verschoben und als Online-Konferenz abgehalten. | ||
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==Topics of Interest== | ==Topics of Interest== | ||
IRPS 2021 is soliciting increased participation in the following special focus topic areas. | IRPS 2021 is soliciting increased participation in the following special focus topic areas. | ||
− | * Circuit Reliability and Aging – RAS, self-healing, aging aware designs, design tools | + | *Circuit Reliability and Aging – RAS, self-healing, aging aware designs, design tools |
− | * Emerging memory / Neuromorphic Computing– Reliability for PCM, MRAM, RRAM, ferroelectrics | + | *Emerging memory / Neuromorphic Computing– Reliability for PCM, MRAM, RRAM, ferroelectrics |
− | * Reliability of RF/mmW/5G Devices – CMOS, SiGe BiCMOS, SOI, GaAs, GaN | + | *Reliability of RF/mmW/5G Devices – CMOS, SiGe BiCMOS, SOI, GaAs, GaN |
Papers in the following areas are requested. | Papers in the following areas are requested. | ||
Circuits, Products, and Systems | Circuits, Products, and Systems | ||
− | * Circuit Reliability and Aging | + | *Circuit Reliability and Aging |
− | * IC Product Reliability | + | *IC Product Reliability |
− | * System Electronics Reliability | + | *System Electronics Reliability |
− | * Soft Errors | + | *Soft Errors |
− | * ESD and Latchup | + | *ESD and Latchup |
− | * Packaging and 2.5D/3D Assembly | + | *Packaging and 2.5D/3D Assembly |
− | * Reliability Testing | + | *Reliability Testing |
− | * Silicon Photonics | + | *Silicon Photonics |
− | * RF/mmW/5G | + | *RF/mmW/5G |
Materials, Processing, and Devices | Materials, Processing, and Devices | ||
− | * Transistors | + | *Transistors |
− | * Gate/MOL Dielectrics | + | *Gate/MOL Dielectrics |
− | * Beyond CMOS Devices | + | *Beyond CMOS Devices |
− | * Neuromorphic Computing Reliability | + | *Neuromorphic Computing Reliability |
− | * Wide-Bandgap Semiconductors | + | *Wide-Bandgap Semiconductors |
− | * Compound and Optoelectronic Devices | + | *Compound and Optoelectronic Devices |
− | * Metallization/BEOL Reliability | + | *Metallization/BEOL Reliability |
− | * Process Integration | + | *Process Integration |
− | * Failure Analysis | + | *Failure Analysis |
− | * Memory Reliability | + | *Memory Reliability |
− | * Photovoltaics | + | *Photovoltaics |
− | * MEMS | + | *MEMS |
Latest revision as of 13:35, 20 March 2024
Deadlines
Metrics
Venue
Warning: Venue is missing. The map might not show the exact location.
Sollte eigentlich vom 29.03.2020-02.04.2020 in Dallas, Texas, USA stattfinden, wurde aufgrund der COVID-19 Pandemie aber zeitlich verschoben und als Online-Konferenz abgehalten.
Topics of Interest
IRPS 2021 is soliciting increased participation in the following special focus topic areas.
- Circuit Reliability and Aging – RAS, self-healing, aging aware designs, design tools
- Emerging memory / Neuromorphic Computing– Reliability for PCM, MRAM, RRAM, ferroelectrics
- Reliability of RF/mmW/5G Devices – CMOS, SiGe BiCMOS, SOI, GaAs, GaN
Papers in the following areas are requested.
Circuits, Products, and Systems
- Circuit Reliability and Aging
- IC Product Reliability
- System Electronics Reliability
- Soft Errors
- ESD and Latchup
- Packaging and 2.5D/3D Assembly
- Reliability Testing
- Silicon Photonics
- RF/mmW/5G
Materials, Processing, and Devices
- Transistors
- Gate/MOL Dielectrics
- Beyond CMOS Devices
- Neuromorphic Computing Reliability
- Wide-Bandgap Semiconductors
- Compound and Optoelectronic Devices
- Metallization/BEOL Reliability
- Process Integration
- Failure Analysis
- Memory Reliability
- Photovoltaics
- MEMS