Difference between revisions of "Event:SYSINT 2020"

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|City=Bremen
 
|City=Bremen
 
|Country=Country:DE
 
|Country=Country:DE
|Submission deadline=2020/02/20
 
|Abstract deadline=2019/11/10
 
|Notification=2019/12/20
 
 
|Has coordinator=University of Bremen, University of Paderborn, Leibniz Universität Hannover
 
|Has coordinator=University of Bremen, University of Paderborn, Leibniz Universität Hannover
 
|has program chair=Prof. Berend Denkena, Prof. Walter Lang, Prof. Klaus-Dieter Thoben, Prof. Ansgar Trächtler
 
|has program chair=Prof. Berend Denkena, Prof. Walter Lang, Prof. Klaus-Dieter Thoben, Prof. Ansgar Trächtler
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|Event Mode=on site
 
|Event Mode=on site
 
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|Abstract Deadline=2019/11/10
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|Notification Deadline=2019/12/20
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|Submission Deadline=2020/02/20
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For the 5th time since 2012, the SysInt conference provides a forum for academia and industry to disseminate their latest innovations and practices in the field of system-integrated intelligence. The focus is on integration of new, intelligent functionalities into materials, components, systems and products to enable future technologies with enhanced capabilities. Industry 4.0 and smart manufacturing solutions will feature prominently in the final programme.
 
For the 5th time since 2012, the SysInt conference provides a forum for academia and industry to disseminate their latest innovations and practices in the field of system-integrated intelligence. The focus is on integration of new, intelligent functionalities into materials, components, systems and products to enable future technologies with enhanced capabilities. Industry 4.0 and smart manufacturing solutions will feature prominently in the final programme.
  

Revision as of 21:07, 22 September 2022

Deadlines
2019-12-20
2019-11-10
2020-02-20
10
Nov
2019
Abstract
20
Dec
2019
Notification
20
Feb
2020
Submission
Venue

Bremen, Germany

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For the 5th time since 2012, the SysInt conference provides a forum for academia and industry to disseminate their latest innovations and practices in the field of system-integrated intelligence. The focus is on integration of new, intelligent functionalities into materials, components, systems and products to enable future technologies with enhanced capabilities. Industry 4.0 and smart manufacturing solutions will feature prominently in the final programme.

Topics

• Intelligent Systems: Enabling Technologies and Artificial Intelligence

• The Future of Manufacturing: Cyber-Physical Production and Logistic Systems

• Pervasive and Ubiquitous Computing

• Structural Health Monitoring

• Systems Engineering

• Soft Robotics and Human-Machine-Interaction

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