(mobo import Concept___Event_For_Confident-migrated) |
m (Text replacement - "Homepage=" to "Official Website=") |
||
(6 intermediate revisions by the same user not shown) | |||
Line 1: | Line 1: | ||
{{Event | {{Event | ||
|Acronym=HOTCHIPS 2022 | |Acronym=HOTCHIPS 2022 | ||
− | |Title=Symposium on High Performance | + | |Title=Symposium on High Performance Chips |
|Ordinal=34 | |Ordinal=34 | ||
|Type=Conference | |Type=Conference | ||
− | | | + | |Official Website=https://www.hotchips.org/ |
|City=Silicon Valley | |City=Silicon Valley | ||
− | | | + | |Region=California |
− | |Country= | + | |Country=Country:US |
− | |||
− | |||
− | |||
− | |||
|pageCreator=User:Curator 53 | |pageCreator=User:Curator 53 | ||
|pageEditor=User:Curator 53 | |pageEditor=User:Curator 53 | ||
Line 19: | Line 15: | ||
|Start Date=August 2022 | |Start Date=August 2022 | ||
|End Date=August 2022 | |End Date=August 2022 | ||
+ | |Event Status=as scheduled | ||
+ | |Event Mode=on site | ||
}} | }} | ||
+ | {{Event Deadline | ||
+ | |Paper Deadline=2022/03/22 | ||
+ | |Poster Deadline=2022/04/28 | ||
+ | |Notification Deadline=2022/05/02 | ||
+ | }} | ||
+ | {{S Event}} | ||
=== Areas of Interest === | === Areas of Interest === | ||
− | ==== General-Purpose Processor | + | ==== General-Purpose Processor Chips ==== |
* High-Performance, Low-Power | * High-Performance, Low-Power | ||
* Multi-Core and Highly-Reliable Systems | * Multi-Core and Highly-Reliable Systems | ||
− | ==== Domain-Specific | + | ==== Domain-Specific Chips ==== |
− | * Machine Learning, Vision and Graphics | + | * Machine Learning, Vision and Graphics Chips |
* Data Analytics and Big Data Processing | * Data Analytics and Big Data Processing | ||
* IoT and Always-On Functions | * IoT and Always-On Functions | ||
− | * Custom | + | * Custom Chips for Emerging Applications |
− | ==== Reconfigurable | + | ==== Reconfigurable Chips ==== |
* FPGAs and FPGA-Based Systems | * FPGAs and FPGA-Based Systems | ||
* Coarse-Grained Reconfigurable Arrays | * Coarse-Grained Reconfigurable Arrays | ||
Line 37: | Line 41: | ||
==== Mobile and Embedded Devices ==== | ==== Mobile and Embedded Devices ==== | ||
* Graphics/Multimedia/Gaming | * Graphics/Multimedia/Gaming | ||
− | * SoC, Security, and DSP | + | * SoC, Security, and DSP Chips |
==== Communications and Networking ==== | ==== Communications and Networking ==== | ||
* Wireless LAN/WAN/PAN | * Wireless LAN/WAN/PAN | ||
Line 45: | Line 49: | ||
* Quantum Computing | * Quantum Computing | ||
==== Memory Technologies ==== | ==== Memory Technologies ==== | ||
− | * Persistent Memory, Phase | + | * Persistent Memory, Phase Change |
* Packaging, 3D, Stacked | * Packaging, 3D, Stacked | ||
==== Other Enabling Technologies ==== | ==== Other Enabling Technologies ==== | ||
Line 51: | Line 55: | ||
* Packaging and Testing | * Packaging and Testing | ||
* Display Technologies | * Display Technologies | ||
− | * On- | + | * On-Chip Optics & Sensors |
* Novel Computing Technologies | * Novel Computing Technologies | ||
==== Software and Systems for Emerging Hardware ==== | ==== Software and Systems for Emerging Hardware ==== | ||
* Programming Models, Runtime Systems | * Programming Models, Runtime Systems | ||
* Performance, Power, Debug and Evaluation | * Performance, Power, Debug and Evaluation |
Latest revision as of 13:33, 19 October 2022
Deadlines
|
||
Paper |
|
||
Poster |
|
||
Notification |
Venue
Silicon Valley, California, United States of America
Warning: Venue is missing. The map might not show the exact location.
Areas of Interest
General-Purpose Processor Chips
- High-Performance, Low-Power
- Multi-Core and Highly-Reliable Systems
Domain-Specific Chips
- Machine Learning, Vision and Graphics Chips
- Data Analytics and Big Data Processing
- IoT and Always-On Functions
- Custom Chips for Emerging Applications
Reconfigurable Chips
- FPGAs and FPGA-Based Systems
- Coarse-Grained Reconfigurable Arrays
Security
- Secure Hardware
- Hardware Support for Software Security
Mobile and Embedded Devices
- Graphics/Multimedia/Gaming
- SoC, Security, and DSP Chips
Communications and Networking
- Wireless LAN/WAN/PAN
- Network and I/O Processors
Emerging Computing Architectures
- Neuromorphic
- Quantum Computing
Memory Technologies
- Persistent Memory, Phase Change
- Packaging, 3D, Stacked
Other Enabling Technologies
- Power and Thermal Management
- Packaging and Testing
- Display Technologies
- On-Chip Optics & Sensors
- Novel Computing Technologies
Software and Systems for Emerging Hardware
- Programming Models, Runtime Systems
- Performance, Power, Debug and Evaluation