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|City=Silicon Valley | |City=Silicon Valley | ||
− | | | + | |Region=California |
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|Start Date=August 2022 | |Start Date=August 2022 | ||
|End Date=August 2022 | |End Date=August 2022 | ||
+ | |Event Status=as scheduled | ||
+ | |Event Mode=on site | ||
}} | }} | ||
+ | {{Event Deadline | ||
+ | |Paper Deadline=2022/03/22 | ||
+ | |Poster Deadline=2022/04/28 | ||
+ | |Notification Deadline=2022/05/02 | ||
+ | }} | ||
+ | {{S Event}} | ||
=== Areas of Interest === | === Areas of Interest === | ||
==== General-Purpose Processor Chips ==== | ==== General-Purpose Processor Chips ==== |
Latest revision as of 13:33, 19 October 2022
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Venue
Silicon Valley, California, United States of America
Warning: Venue is missing. The map might not show the exact location.
Areas of Interest
General-Purpose Processor Chips
- High-Performance, Low-Power
- Multi-Core and Highly-Reliable Systems
Domain-Specific Chips
- Machine Learning, Vision and Graphics Chips
- Data Analytics and Big Data Processing
- IoT and Always-On Functions
- Custom Chips for Emerging Applications
Reconfigurable Chips
- FPGAs and FPGA-Based Systems
- Coarse-Grained Reconfigurable Arrays
Security
- Secure Hardware
- Hardware Support for Software Security
Mobile and Embedded Devices
- Graphics/Multimedia/Gaming
- SoC, Security, and DSP Chips
Communications and Networking
- Wireless LAN/WAN/PAN
- Network and I/O Processors
Emerging Computing Architectures
- Neuromorphic
- Quantum Computing
Memory Technologies
- Persistent Memory, Phase Change
- Packaging, 3D, Stacked
Other Enabling Technologies
- Power and Thermal Management
- Packaging and Testing
- Display Technologies
- On-Chip Optics & Sensors
- Novel Computing Technologies
Software and Systems for Emerging Hardware
- Programming Models, Runtime Systems
- Performance, Power, Debug and Evaluation