Difference between revisions of "Event:HOTCHIPS 2022"

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{{Event
 
{{Event
 
|Acronym=HOTCHIPS 2022
 
|Acronym=HOTCHIPS 2022
|Title=Symposium on High Performance User:Curator 83ips
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|Title=Symposium on High Performance Chips
 
|Ordinal=34
 
|Ordinal=34
 
|Type=Conference
 
|Type=Conference
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}}
 
}}
 
=== Areas of Interest ===
 
=== Areas of Interest ===
==== General-Purpose Processor User:Curator 83ips ====
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==== General-Purpose Processor Chips ====
 
* High-Performance, Low-Power
 
* High-Performance, Low-Power
 
* Multi-Core and Highly-Reliable Systems
 
* Multi-Core and Highly-Reliable Systems
==== Domain-Specific User:Curator 83ips ====
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==== Domain-Specific Chips ====
* Machine Learning, Vision and Graphics User:Curator 83ips
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* Machine Learning, Vision and Graphics Chips
 
* Data Analytics and Big Data Processing
 
* Data Analytics and Big Data Processing
 
* IoT and Always-On Functions
 
* IoT and Always-On Functions
* Custom User:Curator 83ips for Emerging Applications
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* Custom Chips for Emerging Applications
==== Reconfigurable User:Curator 83ips ====
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==== Reconfigurable Chips ====
 
* FPGAs and FPGA-Based Systems
 
* FPGAs and FPGA-Based Systems
 
* Coarse-Grained Reconfigurable Arrays
 
* Coarse-Grained Reconfigurable Arrays
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==== Mobile and Embedded Devices ====
 
==== Mobile and Embedded Devices ====
 
* Graphics/Multimedia/Gaming
 
* Graphics/Multimedia/Gaming
* SoC, Security, and DSP User:Curator 83ips
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* SoC, Security, and DSP Chips
 
==== Communications and Networking ====
 
==== Communications and Networking ====
 
* Wireless LAN/WAN/PAN
 
* Wireless LAN/WAN/PAN
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* Quantum Computing
 
* Quantum Computing
 
==== Memory Technologies ====
 
==== Memory Technologies ====
* Persistent Memory, Phase User:Curator 83ange
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* Persistent Memory, Phase Change
 
* Packaging, 3D, Stacked
 
* Packaging, 3D, Stacked
 
==== Other Enabling Technologies ====
 
==== Other Enabling Technologies ====

Revision as of 12:37, 7 July 2022

Areas of Interest

General-Purpose Processor Chips

  • High-Performance, Low-Power
  • Multi-Core and Highly-Reliable Systems

Domain-Specific Chips

  • Machine Learning, Vision and Graphics Chips
  • Data Analytics and Big Data Processing
  • IoT and Always-On Functions
  • Custom Chips for Emerging Applications

Reconfigurable Chips

  • FPGAs and FPGA-Based Systems
  • Coarse-Grained Reconfigurable Arrays

Security

  • Secure Hardware
  • Hardware Support for Software Security

Mobile and Embedded Devices

  • Graphics/Multimedia/Gaming
  • SoC, Security, and DSP Chips

Communications and Networking

  • Wireless LAN/WAN/PAN
  • Network and I/O Processors

Emerging Computing Architectures

  • Neuromorphic
  • Quantum Computing

Memory Technologies

  • Persistent Memory, Phase Change
  • Packaging, 3D, Stacked

Other Enabling Technologies

  • Power and Thermal Management
  • Packaging and Testing
  • Display Technologies
  • On-Chip Optics & Sensors
  • Novel Computing Technologies

Software and Systems for Emerging Hardware

  • Programming Models, Runtime Systems
  • Performance, Power, Debug and Evaluation
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