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|Acronym=APEC 2018 | |Acronym=APEC 2018 | ||
|Title=IEEE Applied Power Electronics Conference and Exposition | |Title=IEEE Applied Power Electronics Conference and Exposition | ||
| − | | | + | |In Event Series=Event Series:APEC |
| + | |Single Day Event=no | ||
| + | |Start Date=2018/03/04 | ||
| + | |End Date=2018/03/08 | ||
| + | |Event Status=as scheduled | ||
| + | |Event Mode=on site | ||
| + | |Venue=Henry B. González Convention Center | ||
|City=San Antonio | |City=San Antonio | ||
|Region=Texas | |Region=Texas | ||
|Country=Country:US | |Country=Country:US | ||
| + | |Academic Field=Electronics; Electrical Electronic Engineer | ||
| + | |Type=Conference | ||
|has general chair=Eric Persson | |has general chair=Eric Persson | ||
|has program chair=Ernie Parker | |has program chair=Ernie Parker | ||
| Line 12: | Line 20: | ||
|pageEditor=User:Curator 27 | |pageEditor=User:Curator 27 | ||
|contributionType=1 | |contributionType=1 | ||
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}} | }} | ||
{{Event Deadline}} | {{Event Deadline}} | ||
| + | {{Organizer | ||
| + | |Contributor Type=organization | ||
| + | |Organization=IEEE Industry Applications Society, Institute of Electrical and Electronics Engineers | ||
| + | }} | ||
| + | {{Organizer | ||
| + | |Contributor Type=organization | ||
| + | |Organization=IEEE Power Electronics Society, Institute of Electrical and Electronics Engineers | ||
| + | }} | ||
| + | {{Organizer | ||
| + | |Contributor Type=organization | ||
| + | |Organization=The Multinational Power Electronics Association | ||
| + | }} | ||
| + | {{Event Metric}} | ||
{{S Event}} | {{S Event}} | ||
| − | ''33nd annual IEEE Applied Power Electronics Conference and Exposition (APEC 2018), at the Henry B. Gonzalez Convention Center, | + | ''33nd annual IEEE Applied Power Electronics Conference and Exposition (APEC 2018), at the Henry B. Gonzalez Convention Center,'' |
San Antonio, Texas. APEC brings together power electronic professionals from all sectors | San Antonio, Texas. APEC brings together power electronic professionals from all sectors | ||
annually to participate in a rewarding exchange of technical knowledge, while gaining insight and valuable | annually to participate in a rewarding exchange of technical knowledge, while gaining insight and valuable | ||
| − | industry connections. | + | industry connections. |
| − | * TOPICS OF INTEREST | + | *TOPICS OF INTEREST |
| − | * | + | * |
| − | * 1. AC-DC Converters: | + | *1. AC-DC Converters: |
| − | * | + | *Single-Phase and Three-Phase Input |
| − | * | + | *Power Factor Correction, CCM, DCM, CRM/BCM Control, Bridgeless |
| − | * | + | *Embedded AC-DC Power Supplies |
| − | * | + | *External AC-DC Adapters |
| − | * | + | * |
| − | * 2. DC-DC Converters: | + | *2. DC-DC Converters: |
| − | * | + | *Hard- and Soft-Switched |
| − | * | + | *Resonant Converters |
| − | * | + | *Point-of-Load (PoL) and Multi-Phase Converters |
| − | * | + | *Voltage Regulator Modules (VRM) |
| − | * | + | * |
| − | * 3. Power Electronics for Utility Interface: | + | *3. Power Electronics for Utility Interface: |
| − | * | + | *Power Generation, Transmission and Distribution |
| − | * | + | *Power Quality, UPS, Filters |
| − | * | + | *Distributed Energy Systems |
| − | * | + | *SmartGrid |
| − | * | + | *UPS |
| − | * | + | *Solid-State Transformers |
| − | * | + | *Metering |
| − | * | + | * |
| − | * 4. Motor Drives and Inverters: | + | *4. Motor Drives and Inverters: |
| − | * | + | *AC, DC, BLDC Motor Drives |
| − | * | + | *Single- and Multi-Phase Inverters |
| − | * | + | *Sensor Integration |
| − | * | + | *Actuators |
| − | * | + | *High Performance Drives |
| − | * | + | * |
| − | * 5. Devices and Components: | + | *5. Devices and Components: |
| − | * | + | *Power Silicon MOSFETs, BJTs, IGBTs |
| − | * | + | *GaN HEMTs, |
| − | * | + | *SiC MOSFETs and BJTs |
| − | * | + | *Fast Recovery Diodes |
| − | * | + | *Magnetic Materials and Components |
| − | * | + | *Capacitors, Supercapacitors |
| − | * | + | *Interconnects and Fuses |
| − | * | + | * |
| − | * 6. Power Electronics Integration and Manufacturing: | + | *6. Power Electronics Integration and Manufacturing: |
| − | * | + | *Power Electronics Packaging |
| − | * | + | *Power Modules / High Density Design |
| − | * | + | *Thermal and EMC Management |
| − | * | + | *Quality and System Reliability |
| − | * | + | *Embedding technologies, 3D packaging, and additive manufacturing |
| − | * | + | *Production Processes and Design for Manufacturability |
| − | * | + | * |
| − | * 7. Modeling and Simulation: | + | *7. Modeling and Simulation: |
| − | * | + | *Circuits and Systems |
| − | * | + | *Device and Component Modeling |
| − | * | + | *Parasitics |
| − | * | + | *Software Tools |
| − | * | + | *Rapid Prototyping |
| − | * | + | * |
| − | * 8. Control: | + | *8. Control: |
| − | * | + | * |
| − | * | + | *Control of Power Electronic Converters |
| − | * | + | *Current-Mode and Voltage-Mode Control |
| − | * | + | *Digital Control |
| − | * | + | *Sensor and Sensor-less Control |
| − | * | + | *Gate Drive Circuits |
| − | * | + | *Control ICs |
| − | * | + | *MCUs, DSPs, FPGAs, ASICs |
| − | * | + | * |
| − | * 9. Wireless Power Transfer: | + | *9. Wireless Power Transfer: |
| − | * | + | *Wireless charging |
| − | * | + | *Energy harvesting |
| − | * | + | *Power for IoT |
| − | * | + | *Non-contact Sensors for Power Electronics |
| − | * 10. Renewable Energy Systems: | + | *10. Renewable Energy Systems: |
| − | * | + | *Photovoltaic (PV) Inverters and Micro Inverters |
| − | * | + | *Maximum power point tracking (MPPT) |
| − | * | + | *Wind Energy Conversion Systems |
| − | * | + | *Fuel Cells |
| − | * | + | *Grid-Tied Systems |
| − | * | + | *Bi-directional Power Converters |
| − | * | + | *Microgrid Systems |
| − | * | + | *Energy Storage Systems |
| − | * | + | * |
| − | * 11. Transportation Power Electronics: | + | *11. Transportation Power Electronics: |
| − | * | + | *Vehicular Power Electronic Circuits and Systems |
| − | * | + | *Power Electronics for Hybrid and Electric Cars |
| − | * | + | *Power Electronics for Aerospace |
| − | * | + | *Charging Systems |
| − | * | + | * |
| − | * 12. Power Electronics Applications: | + | *12. Power Electronics Applications: |
| − | * | + | *Lamp Ballasts and LED Lighting |
| − | * | + | *Network and Telecommunication Power Electronics |
| − | * | + | *Defense and Military Power Electronics |
| − | * | + | *AC-DC-AC Applications and Matrix Converters |
| − | * | + | *Portable Power |
| − | * | + | *Energy Harvesting |
Latest revision as of 09:20, 4 April 2023
Deadlines
Metrics
Venue
Henry B. González Convention Center, San Antonio, Texas, United States of America
33nd annual IEEE Applied Power Electronics Conference and Exposition (APEC 2018), at the Henry B. Gonzalez Convention Center, San Antonio, Texas. APEC brings together power electronic professionals from all sectors annually to participate in a rewarding exchange of technical knowledge, while gaining insight and valuable industry connections.
- TOPICS OF INTEREST
- 1. AC-DC Converters:
- Single-Phase and Three-Phase Input
- Power Factor Correction, CCM, DCM, CRM/BCM Control, Bridgeless
- Embedded AC-DC Power Supplies
- External AC-DC Adapters
- 2. DC-DC Converters:
- Hard- and Soft-Switched
- Resonant Converters
- Point-of-Load (PoL) and Multi-Phase Converters
- Voltage Regulator Modules (VRM)
- 3. Power Electronics for Utility Interface:
- Power Generation, Transmission and Distribution
- Power Quality, UPS, Filters
- Distributed Energy Systems
- SmartGrid
- UPS
- Solid-State Transformers
- Metering
- 4. Motor Drives and Inverters:
- AC, DC, BLDC Motor Drives
- Single- and Multi-Phase Inverters
- Sensor Integration
- Actuators
- High Performance Drives
- 5. Devices and Components:
- Power Silicon MOSFETs, BJTs, IGBTs
- GaN HEMTs,
- SiC MOSFETs and BJTs
- Fast Recovery Diodes
- Magnetic Materials and Components
- Capacitors, Supercapacitors
- Interconnects and Fuses
- 6. Power Electronics Integration and Manufacturing:
- Power Electronics Packaging
- Power Modules / High Density Design
- Thermal and EMC Management
- Quality and System Reliability
- Embedding technologies, 3D packaging, and additive manufacturing
- Production Processes and Design for Manufacturability
- 7. Modeling and Simulation:
- Circuits and Systems
- Device and Component Modeling
- Parasitics
- Software Tools
- Rapid Prototyping
- 8. Control:
- Control of Power Electronic Converters
- Current-Mode and Voltage-Mode Control
- Digital Control
- Sensor and Sensor-less Control
- Gate Drive Circuits
- Control ICs
- MCUs, DSPs, FPGAs, ASICs
- 9. Wireless Power Transfer:
- Wireless charging
- Energy harvesting
- Power for IoT
- Non-contact Sensors for Power Electronics
- 10. Renewable Energy Systems:
- Photovoltaic (PV) Inverters and Micro Inverters
- Maximum power point tracking (MPPT)
- Wind Energy Conversion Systems
- Fuel Cells
- Grid-Tied Systems
- Bi-directional Power Converters
- Microgrid Systems
- Energy Storage Systems
- 11. Transportation Power Electronics:
- Vehicular Power Electronic Circuits and Systems
- Power Electronics for Hybrid and Electric Cars
- Power Electronics for Aerospace
- Charging Systems
- 12. Power Electronics Applications:
- Lamp Ballasts and LED Lighting
- Network and Telecommunication Power Electronics
- Defense and Military Power Electronics
- AC-DC-AC Applications and Matrix Converters
- Portable Power
- Energy Harvesting
