and Latchup Packaging and 2.5D/3D Assembly Reliability Testing Silicon Photonics RF/mmW/5G Materials, Processing, and Devices Transistors Gate/MOL Dielectrics
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Bonn Region North Rhine-Westphalia Country Germany (DE) Academic Field Photonics, Physics, Quantum Optics, Molecular Physics Official Website https://www
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applications such as lasers, memories, photo-detectors and amplifiers - Photonic crystal devices containing quantum dots - Molecular quantum dots and hybrid
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Telecommunication and Multimedia * RF and Wireless Circuits and Systems * Photonic and Optoelectronic Circuits * Assembly and Packaging * Test and Reliability
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Transfer Division - ASME Bioengineering Division - ASME Electronic and Photonic Packaging Division - ASME IGTI/Heat Transfer in Gas Turbines - ASME Nuclear
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bio-inspired and neuromorphic systems 6. Analog, RF, Mixed Signal, and Photonics: 6.1. Analog/mixed-signal/RF synthesis 6.2. Analog layout, verification
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Wireless Communications Cloud Communications and Computing Optical and Photonic Communications Green Networking Technologies Multimedia and Virtual Reality
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Wireless Communications Cloud Communications and Computing Optical and Photonic Communications Green Networking Technologies Multimedia and Virtual Reality
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Artificial Intelligence AOPC 2023 2023-07-25 → 2023-07-27 China (CN) Optics Photonics ACIIDS 2023 2023-07-24 → 2023-07-26 Thailand (TH) Information Systems Database
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Image reconstruction * Image segmentation and analysis Biomedical Optics * Photonic therapeutics, diagnostics and instrumentation * Biophotonics and multiphoton
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Generation Networks 1 .13 Optical systems, Networks and Applications 1 .12 Photonic Switching and Interconnections 1 .4 Switching and Routing 1 .7 Traffic
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colloquiums and number of special sessions on selected topics. Colloquium on - Photonic Communications Systems and Networks - Optical Wireless Communications -
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Theory of Cryptography Conference 2021-11-08 POEM 2021 POEM - International Photonics and OptoElectronics Meetings 2021-11-06 CCKS 2021 CCKS - China Conference
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devices and integration techniques, such as qubits, spintronics, 3D, and photonic integration), to original approaches (such as Artificial Intelligence (AI)
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