Difference between revisions of "Event:SPM 2017"

From ConfIDent
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|Acronym=SPM 2017
 
|Acronym=SPM 2017
 
|Title=Solid and Physical Modeling 2017
 
|Title=Solid and Physical Modeling 2017
|Type=Conference
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|In Event Series=Event Series:SPM
|Official Website=https://s3pm.icsi.berkeley.edu/s3pm/spm.html
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|Single Day Event=no
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|Start Date=2017/06/19
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|End Date=2017/06/21
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|Event Status=as scheduled
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|Event Mode=on site
 
|City=Berkeley
 
|City=Berkeley
 
|Country=Country:US
 
|Country=Country:US
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|Official Website=https://s3pm.icsi.berkeley.edu/s3pm/spm.html
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|DOI=10.25798/x87e-3p18
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|Type=Conference
 
|has program chair=Mario Botsch, Stefanie Hahmann, Jessica Zhang
 
|has program chair=Mario Botsch, Stefanie Hahmann, Jessica Zhang
 
|Has PC member=Nina Amenta, Cecil Armstrong, Chandrajit Bajaj, Michael Barton, Carolina Beccari, Dominique Bechmann
 
|Has PC member=Nina Amenta, Cecil Armstrong, Chandrajit Bajaj, Michael Barton, Carolina Beccari, Dominique Bechmann
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|pageEditor=User:Curator 55
 
|pageEditor=User:Curator 55
 
|contributionType=1
 
|contributionType=1
|In Event Series=Event Series:SPM
 
|Single Day Event=no
 
|Start Date=2017/06/19
 
|End Date=2017/06/21
 
|Event Status=as scheduled
 
|Event Mode=on site
 
 
}}
 
}}
 
{{Event Deadline}}
 
{{Event Deadline}}
{{S Event}}
 
 
{{Organizer
 
{{Organizer
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|Contributor Type=organization
 
|Organization=International Computer Science Institute (ICSI)
 
|Organization=International Computer Science Institute (ICSI)
|Contributor Type=organization
 
 
}}
 
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{{Event Metric}}
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{{S Event}}
 
The Symposium on Solid and Physical Modeling (SPM-2017) will be co-located with Shape Modeling International (SMI-2017) Symposium as part of the International Convention on Shape, Solid, Structure, & Physical Modeling (S3PM-2017) in Berkeley, California.
 
The Symposium on Solid and Physical Modeling (SPM-2017) will be co-located with Shape Modeling International (SMI-2017) Symposium as part of the International Convention on Shape, Solid, Structure, & Physical Modeling (S3PM-2017) in Berkeley, California.
  
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Accepted full-length papers will be published in a special issue of the Journal of Computer-Aided Design (Elsevier) after a rigorous double-blind review process.
 
Accepted full-length papers will be published in a special issue of the Journal of Computer-Aided Design (Elsevier) after a rigorous double-blind review process.
  
== Topics ==
+
==Topics==
 
We invite submissions related to, but not limited to, the following topics:     
 
We invite submissions related to, but not limited to, the following topics:     
*     3D fabrication/printing/manufacturing technologies
+
*3D fabrication/printing/manufacturing technologies
*     Anisotropic/heterogeneous/composite materials
+
*Anisotropic/heterogeneous/composite materials
*     Applied algebraic and differential geometry
+
*Applied algebraic and differential geometry
*     Applied computational geometry and topology
+
*Applied computational geometry and topology
*     Conceptual, collaborative, and distributed design
+
*Conceptual, collaborative, and distributed design
*     Computational fabrication
+
*Computational fabrication
*     Curve, surface, and manifold modeling
+
*Curve, surface, and manifold modeling
*     Dimensioning and tolerancing
+
*Dimensioning and tolerancing
*     Feature modeling, recognition, and understanding
+
*Feature modeling, recognition, and understanding
*     Geometric algorithms
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*Geometric algorithms
*     Geometric and topological representations
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*Geometric and topological representations
*     Geometric constraint solving and parametric modeling
+
*Geometric constraint solving and parametric modeling
*     Geometric interpolation and smoothing
+
*Geometric interpolation and smoothing
*     Geometry generation and processing
+
*Geometry generation and processing
*     Geometry compression and transmission
+
*Geometry compression and transmission
*     Isogeometric and finite element analysis
+
*Isogeometric and finite element analysis
*     Meshing and mesh optimization
+
*Meshing and mesh optimization
*     Multi-resolution modeling
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*Multi-resolution modeling
*     Numerical analysis of geometric algorithms
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*Numerical analysis of geometric algorithms
*     Physically-based modeling and simulation
+
*Physically-based modeling and simulation
*     Product data exchange, standards, and interoperability
+
*Product data exchange, standards, and interoperability
*     Reverse engineering/reconstruction of surfaces/solids
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*Reverse engineering/reconstruction of surfaces/solids
*     Robustness and validity of geometric computations
+
*Robustness and validity of geometric computations
*     Shape modeling, synthesis, and analysis
+
*Shape modeling, synthesis, and analysis

Latest revision as of 06:06, 10 July 2023

Deadlines
organization
Metrics
Venue

Berkeley, United States of America

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The Symposium on Solid and Physical Modeling (SPM-2017) will be co-located with Shape Modeling International (SMI-2017) Symposium as part of the International Convention on Shape, Solid, Structure, & Physical Modeling (S3PM-2017) in Berkeley, California.

SPM seeks high quality, original research contributions that strive to advance all aspects of geometric and physical modeling, and their application in design, analysis and manufacturing, as well as in biomedical, geophysical, digital entertainment, and other areas. The symposium is organized with the support of the Solid Modeling Association (SMA), which will award the 2017 Pierre Bézier Prize for contributions to solid, shape, and physical modeling during the conference.

Accepted full-length papers will be published in a special issue of the Journal of Computer-Aided Design (Elsevier) after a rigorous double-blind review process.

Topics

We invite submissions related to, but not limited to, the following topics:

  • 3D fabrication/printing/manufacturing technologies
  • Anisotropic/heterogeneous/composite materials
  • Applied algebraic and differential geometry
  • Applied computational geometry and topology
  • Conceptual, collaborative, and distributed design
  • Computational fabrication
  • Curve, surface, and manifold modeling
  • Dimensioning and tolerancing
  • Feature modeling, recognition, and understanding
  • Geometric algorithms
  • Geometric and topological representations
  • Geometric constraint solving and parametric modeling
  • Geometric interpolation and smoothing
  • Geometry generation and processing
  • Geometry compression and transmission
  • Isogeometric and finite element analysis
  • Meshing and mesh optimization
  • Multi-resolution modeling
  • Numerical analysis of geometric algorithms
  • Physically-based modeling and simulation
  • Product data exchange, standards, and interoperability
  • Reverse engineering/reconstruction of surfaces/solids
  • Robustness and validity of geometric computations
  • Shape modeling, synthesis, and analysis
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