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|Title=Electrical Design of Advanced Packaging and Systems Symposium | |Title=Electrical Design of Advanced Packaging and Systems Symposium | ||
|Type=Conference | |Type=Conference | ||
| − | | | + | |Official Website=http://www.edaps2008.org/Contents/Callforpaper.asp%20globalmenu=5&localmenu=1 |
|City=Seoul | |City=Seoul | ||
| − | |Country= | + | |Country=Country:KR |
| − | |||
|wikicfpId=3014 | |wikicfpId=3014 | ||
|pageCreator=127.0.0.1 | |pageCreator=127.0.0.1 | ||
| Line 14: | Line 13: | ||
|End Date=Dec 12, 2008 | |End Date=Dec 12, 2008 | ||
|Academic Field=Manufacturing | |Academic Field=Manufacturing | ||
| + | |Event Status=as scheduled | ||
| + | |Event Mode=on site | ||
}} | }} | ||
| + | {{Event Deadline | ||
| + | |Submission Deadline=Jul 31, 2008 | ||
| + | }} | ||
| + | {{S Event}} | ||
<pre></pre>This CfP was obtained from [http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=3014&copyownerid=2 WikiCFP] | <pre></pre>This CfP was obtained from [http://www.wikicfp.com/cfp/servlet/event.showcfp?eventid=3014&copyownerid=2 WikiCFP] | ||
Latest revision as of 14:46, 19 October 2022
Deadlines
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| Submission |
Venue
Seoul, Korea (Republic of)
Warning: Venue is missing. The map might not show the exact location.
This CfP was obtained from WikiCFP
