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|Title=Symposium on Solid and Physical Modeling 2016 | |Title=Symposium on Solid and Physical Modeling 2016 | ||
|Type=Conference | |Type=Conference | ||
| − | | | + | |Official Website=http://igs2016.mi.fu-berlin.de/spm2016/ |
|City=Berlin | |City=Berlin | ||
|Country=Country:DE | |Country=Country:DE | ||
|has program chair=Mario Botsch, Stefanie Hahmann, Scott Schaefer | |has program chair=Mario Botsch, Stefanie Hahmann, Scott Schaefer | ||
|Has PC member=Carolina Beccari, Dominique Bechmann, Mirela Ben-Chen, Michel Bercovier, Georges-Pierre Bonneau, Wim Bronsvoort | |Has PC member=Carolina Beccari, Dominique Bechmann, Mirela Ben-Chen, Michel Bercovier, Georges-Pierre Bonneau, Wim Bronsvoort | ||
| − | |||
| − | |||
|pageCreator=User:Curator 55 | |pageCreator=User:Curator 55 | ||
|pageEditor=User:Curator 55 | |pageEditor=User:Curator 55 | ||
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}} | }} | ||
{{Event Deadline}} | {{Event Deadline}} | ||
| + | {{Event Metric | ||
| + | |Number Of Submitted Papers=62 | ||
| + | |Number Of Accepted Papers=19 | ||
| + | }} | ||
{{S Event}} | {{S Event}} | ||
==Topics== | ==Topics== | ||
Latest revision as of 14:23, 19 October 2022
Deadlines
Metrics
Submitted Papers
62
Accepted Papers
19
Venue
Berlin, Germany
Warning: Venue is missing. The map might not show the exact location.
Topics
* 3D Fabrication/printing/manufacturing technologies * Anisotropic/heterogeneous/composite materials * Applied algebraic and differential geometry * Applied computational geometry and topology * Conceptual, collaborative, and distributed design * Curve, surface, and manifold modeling * Dimensioning and tolerancing * Feature modeling, recognition, and understanding * Geometric and topological representations * Geometric constraint solving and parametric modeling * Geometric interpolation and smoothing * Geometry generation and processing * Geometry compression and transmission * Isogeometric and finite element analysis * Meshing and mesh optimization * Multi-resolution modeling * Numerical analysis of geometric algorithms * Physically-based modeling and simulation * Product data exchange, standards, and interoperability * Reverse engineering/reconstruction of surfaces/solids * Robustness and validity of geometric computations * Shape modeling, synthesis, and analysis
