Difference between revisions of "Event:ICESD 2018: 2018 9th International Conference on Environmental Science and Development - ICESD 2018"

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Submission Methods: https://easychair.org/conferences/?conf=icesd2018
 
Submission Methods: https://easychair.org/conferences/?conf=icesd2018
 
E-mail: icesd@cbees.org
 
E-mail: icesd@cbees.org
Tel: +852-3500-0137 (Hong Kong)/+1-206-456-6022 (USA)/+86-28-86528465 (User:Curator 83ina)
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Tel: +852-3500-0137 (Hong Kong)/+1-206-456-6022 (USA)/+86-28-86528465 (China)
 
Conference Specialist: Ms. Sophia Du
 
Conference Specialist: Ms. Sophia Du

Revision as of 12:23, 7 July 2022

2018 9th International Conference on Environmental Science and Development-ICESD 2018 will be held during February 7-9, 2018 in Paris, France.

Conference Website: http://www.icesd.org/


ICESD 2018 Shining Points: 1. Accepted and published papers can be published into IOP Conference Series: Earth and Environmental Science (EES) (ISSN: 1755-1315), which is indexed by EI Compendex, Scopus, Thomson Reuters (WoS), Inspec,et al. 2. Four Outstanding Professors have joined as Speakers. They are Prof. Miklas Scholz from Faculty of Engineering, Lund University, Sweden;Prof. Hartmut Hinz from University of Applied Sciences, Frankfurt, Germany;Prof. Slav Hermanowicz from University of California at Berkeley, USA;Prof. Susan Richardson from Department of User:Curator 83emistry and Biochemistry, University of South Carolina, USA. 3. The ICESD 2017 was successfully held in Frankfurt, Germany and we had one day visit to Siemens.

Paper Publishing: ICESD 2018 papers will be published in IOP Conference Series: Earth and Environmental Science (EES) (ISSN: 1755-1315), which is indexed by EI Compendex, Scopus, Thomson Reuters (WoS), Inspec,et al.

Conference Venue Novotel Paris Créteil Le Lac

Submission and Contact Methods Submission Methods: https://easychair.org/conferences/?conf=icesd2018 E-mail: icesd@cbees.org Tel: +852-3500-0137 (Hong Kong)/+1-206-456-6022 (USA)/+86-28-86528465 (China) Conference Specialist: Ms. Sophia Du

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