(mobo import Concept___Events_With_Metrics-migrated) |
Curator 100 (talk | contribs) |
||
| (One intermediate revision by one other user not shown) | |||
| Line 3: | Line 3: | ||
|Title=IEEE Hot Interconnects Symposium | |Title=IEEE Hot Interconnects Symposium | ||
|Ordinal=28 | |Ordinal=28 | ||
| + | |In Event Series=Event Series:HOTI | ||
| + | |Single Day Event=no | ||
| + | |Start Date=2021/08/18 | ||
| + | |End Date=2021/08/20 | ||
| + | |Event Status=as scheduled | ||
| + | |Event Mode=online | ||
| + | |Academic Field=Software Architecture; Hardware Architecture | ||
| + | |Official Website=https://old.hoti.org/2021/ | ||
| + | |Submission Link=https://easychair.org/account/signin# | ||
|Type=Conference | |Type=Conference | ||
| − | |||
|DblpConferenceId=hoti/hoti2021.html | |DblpConferenceId=hoti/hoti2021.html | ||
|wikidataid=Q5910053 | |wikidataid=Q5910053 | ||
|Twitter account=@HotiConference | |Twitter account=@HotiConference | ||
| − | |||
|has general chair=Pavel Shamis, Manjunath Gorentla Venkata | |has general chair=Pavel Shamis, Manjunath Gorentla Venkata | ||
|has program chair=Ryan Grant, Min Si | |has program chair=Ryan Grant, Min Si | ||
| Line 18: | Line 25: | ||
|pageEditor=User:Curator 53 | |pageEditor=User:Curator 53 | ||
|contributionType=1 | |contributionType=1 | ||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
| − | |||
}} | }} | ||
{{Event Deadline | {{Event Deadline | ||
| + | |Notification Deadline=2021/05/24 | ||
|Abstract Deadline=2021/05/31 | |Abstract Deadline=2021/05/31 | ||
|Paper Deadline=2021/05/31 | |Paper Deadline=2021/05/31 | ||
| − | |||
|Submission Deadline=2021/05/31 | |Submission Deadline=2021/05/31 | ||
| + | }} | ||
| + | {{Organizer | ||
| + | |Contributor Type=organization | ||
| + | |Organization=Technical Community on Microprocessors and Microcomputers, Computer Society, Institute of Electrical and Electronics Engineers | ||
}} | }} | ||
{{Event Metric | {{Event Metric | ||
| Line 36: | Line 41: | ||
}} | }} | ||
{{S Event}} | {{S Event}} | ||
| − | ==== Topics of Interest ==== | + | ====Topics of Interest==== |
| − | * Novel and innovative interconnect architectures | + | *Novel and innovative interconnect architectures |
| − | * Multi-core processor interconnects | + | *Multi-core processor interconnects |
| − | * System-on-Chip Interconnects | + | *System-on-Chip Interconnects |
| − | * Advanced chip-to-chip communication technologies | + | *Advanced chip-to-chip communication technologies |
| − | * Optical interconnects Protocol and interfaces for inter-processor communication | + | *Optical interconnects Protocol and interfaces for inter-processor communication |
| − | * Survivability and fault-tolerance of inter-connects | + | *Survivability and fault-tolerance of inter-connects |
| − | * High-speed packet processing engines and network processors | + | *High-speed packet processing engines and network processors |
| − | * Systems software for communication | + | *Systems software for communication |
| − | * System and storage area network architectures and protocols | + | *System and storage area network architectures and protocols |
| − | * High-performance host-network interface architectures | + | *High-performance host-network interface architectures |
| − | * High-bandwidth and low-latency I/O | + | *High-bandwidth and low-latency I/O |
| − | * Pb/s switching and routing technologies | + | *Pb/s switching and routing technologies |
| − | * Innovative architectures for supporting collective communication | + | *Innovative architectures for supporting collective communication |
| − | * Novel communication architectures to support cloud & grid computing | + | *Novel communication architectures to support cloud & grid computing |
| − | * Centralized and distributed cloud interconnects | + | *Centralized and distributed cloud interconnects |
| − | * Requirements driving high-performance interconnects | + | *Requirements driving high-performance interconnects |
| − | * Traffic characterization for HPC systems and commercial data centers | + | *Traffic characterization for HPC systems and commercial data centers |
| − | * Software-defined networking and software overlay networks | + | *Software-defined networking and software overlay networks |
| − | * Software for network bring-up, configuration and performance management (OpenFlow, OpenSM) | + | *Software for network bring-up, configuration and performance management (OpenFlow, OpenSM) |
| − | * Data Center Networking | + | *Data Center Networking |
Latest revision as of 10:36, 8 September 2023
Deadlines
|
||
| Notification |
|
||
| Submission |
|
||
| Abstract |
|
||
| Paper |
Metrics
Submitted Papers
28
Accepted Papers
9
Venue
Warning: Venue is missing. The map might not show the exact location.
Topics of Interest
- Novel and innovative interconnect architectures
- Multi-core processor interconnects
- System-on-Chip Interconnects
- Advanced chip-to-chip communication technologies
- Optical interconnects Protocol and interfaces for inter-processor communication
- Survivability and fault-tolerance of inter-connects
- High-speed packet processing engines and network processors
- Systems software for communication
- System and storage area network architectures and protocols
- High-performance host-network interface architectures
- High-bandwidth and low-latency I/O
- Pb/s switching and routing technologies
- Innovative architectures for supporting collective communication
- Novel communication architectures to support cloud & grid computing
- Centralized and distributed cloud interconnects
- Requirements driving high-performance interconnects
- Traffic characterization for HPC systems and commercial data centers
- Software-defined networking and software overlay networks
- Software for network bring-up, configuration and performance management (OpenFlow, OpenSM)
- Data Center Networking
