Berkeley, United States of America
The Symposium on Solid and Physical Modeling (SPM-2017) will be co-located with Shape Modeling International (SMI-2017) Symposium as part of the International Convention on Shape, Solid, Structure, & Physical Modeling (S3PM-2017) in Berkeley, California.
SPM seeks high quality, original research contributions that strive to advance all aspects of geometric and physical modeling, and their application in design, analysis and manufacturing, as well as in biomedical, geophysical, digital entertainment, and other areas. The symposium is organized with the support of the Solid Modeling Association (SMA), which will award the 2017 Pierre Bézier Prize for contributions to solid, shape, and physical modeling during the conference.
Accepted full-length papers will be published in a special issue of the Journal of Computer-Aided Design (Elsevier) after a rigorous double-blind review process.
Topics
We invite submissions related to, but not limited to, the following topics:
- 3D fabrication/printing/manufacturing technologies
- Anisotropic/heterogeneous/composite materials
- Applied algebraic and differential geometry
- Applied computational geometry and topology
- Conceptual, collaborative, and distributed design
- Computational fabrication
- Curve, surface, and manifold modeling
- Dimensioning and tolerancing
- Feature modeling, recognition, and understanding
- Geometric algorithms
- Geometric and topological representations
- Geometric constraint solving and parametric modeling
- Geometric interpolation and smoothing
- Geometry generation and processing
- Geometry compression and transmission
- Isogeometric and finite element analysis
- Meshing and mesh optimization
- Multi-resolution modeling
- Numerical analysis of geometric algorithms
- Physically-based modeling and simulation
- Product data exchange, standards, and interoperability
- Reverse engineering/reconstruction of surfaces/solids
- Robustness and validity of geometric computations
- Shape modeling, synthesis, and analysis
