HOTI 2021

Deadlines

2021-05-24

2021-05-31

2021-05-31

2021-05-31

24 May 2021

Notification

31 May 2021

Submission

31 May 2021

Abstract

31 May 2021

Paper

organization

Technical Community on Microprocessors and Microcomputers, Computer Society, Institute of Electrical and Electronics Engineers

Metrics

Submitted Papers

28

Accepted Papers

9

Venue

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Topics of Interest

• Novel and innovative interconnect architectures
• Multi-core processor interconnects
• System-on-Chip Interconnects
• Advanced chip-to-chip communication technologies
• Optical interconnects Protocol and interfaces for inter-processor communication
• Survivability and fault-tolerance of inter-connects
• High-speed packet processing engines and network processors
• Systems software for communication
• System and storage area network architectures and protocols
• High-performance host-network interface architectures
• High-bandwidth and low-latency I/O
• Pb/s switching and routing technologies
• Innovative architectures for supporting collective communication
• Novel communication architectures to support cloud & grid computing
• Centralized and distributed cloud interconnects
• Requirements driving high-performance interconnects
• Traffic characterization for HPC systems and commercial data centers
• Software-defined networking and software overlay networks
• Software for network bring-up, configuration and performance management (OpenFlow, OpenSM)
• Data Center Networking